| Version |
Warning |
| Winter 09 |
CAUTION - Vias support varying diameters across layerstack. If this feature is used in design, extra values will be discarded. |
| Winter 09 |
CAUTION - File may contain pads with hole offsets. Hole offset information will be discarded. |
| Winter 09 |
CAUTION - File contains new manufacturing rules. Hole To Hole clearance, Minimum solder mask sliver, Silkscreen Over Exposed Copper and Silkscreen To Silkscreen Clearance rules were introduced in Altium Designer Winter 09.These rules will be discarded. |
| Winter 09 |
CAUTION - 3D models now support texturing.If used in design these textures will be discarded. |
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